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B179 - Springfield Technical Community College Building Envelope Repairs
| Project | FY2014 State Bond Cap |
FY2014 Project- Financed |
FY2014 Federal Funds |
FY2014 Other Funds |
FY2014 Total |
|---|---|---|---|---|---|
| Springfield Technical Community College Building Envelope Repairs |
400,000 | 0 | 0 | 0 | 400,000 |
This funds planning for STCC to address academic and infrastructure needs and opportunities ' developing priorities for repairs, renovations, accessibility, energy upgrades, and other needs.
Location: Springfield
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